Short, practical primers on the four variables that decide solder quality — and the datasheet download center for every ESAMBER instrument.
Preheat, soak, reflow, peak and cooling each leave a fingerprint on the curve. A travelling profiler shows what the joint actually experienced — not the oven setpoint — so you can hold time-above-liquidus and peak within the alloy window. See the R32T →
Oxygen ingress inside the reflow oven drives oxidation, poor wetting and bridging — and over-flowing nitrogen to compensate burns money. Measuring in-oven O₂ against temperature lets you set the lowest nitrogen flow that still holds quality. See the TO81V →
After a changeover or rail adjustment, small parallelism errors and thermal sag cause jams, dropped boards and scorch. Measuring rail width, deformation, level and vibration in production catches the drift before it becomes scrap. See the CBP2000De →
A single good profile isn’t capability — capability is staying in spec, run after run. ESA Profiler and ERES turn captured curves into SPC charts and CPK indices so you can prove (and defend) process capability to your customers.
Original ESAMBER product datasheets (PDF). Need a spec sheet, white paper or software guide that isn’t here? Ask us.