ESAMBER instruments started on the SMT reflow line — but the same travelling, in-process measurement principle applies anywhere temperature, atmosphere or mechanics determine yield.
The core application. Profile the board through every zone (R32T), benchmark the oven’s thermal capability (RE5050D), watch in-oven oxygen and vibration (TO81V), and verify the conveyor that carries it all (CBP2000De). Together they turn solder-defect guesswork into measured root cause.
Sintering furnaces demand tight, repeatable temperature curves to fire contacts without damaging the cell. The R32T captures multi-point curves with ±0.5 ℃ accuracy for SPC control across the firing belt.
Under- or over-cured adhesive shows up as field failures. Travelling temperature profiling confirms the part actually reached and held cure temperature — not just what the oven setpoint claimed.
From -100 to 800 ℃, the R32T documents thermal uniformity through industrial kilns and continuous furnaces — for qualification, drift detection and energy optimization.
Component heat-treat profiles drive hardness and dimensional stability. Capture the real part curve through the line to hold spec and prove traceability.
High-temperature firing of metals and ceramics is unforgiving of thermal variation. Multi-channel profiling maps the gradient across the load so every piece sees the intended curve.
Where product temperature determines safety and quality, the R32T provides validated, recordable thermal data for process control and documentation.
If it runs hot, it can be measured. Tell us the process and we’ll recommend the instrument.