Reflow Oven Process Evaluation System / 回流焊设备评测系统

RE5050D Reflow Explorer

A reflow soldering thermal performance evaluation system that benchmarks oven capability — thermal uniformity, convection, chain-speed stability and CPK — to expose the equipment limitations behind solder defects.

Pricing: Request a Quote

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Key capabilities

• 30 + 3 channel grid maps oven thermal performance, not just one board
• Quantifies uniformity, balance and thermal shock across the oven
• Measures hot-air convection volume and chain-speed fluctuation
• ERES delivers CPK capability analysis to rank oven readiness
• Supports new-oven acceptance, product allocation and energy audits

Dimensions	530 (L) × 500 (W) × 31.5 (H) mm
Recording channels	30 temperature + 3 expansion (convection volume, chain speed, etc.)
Temperature range	0 ~ 350 ℃
Accuracy	±0.5 ℃
Resolution	0.1 ℃
Sampling rate	0.1 ~ 400 s, adjustable
Thermocouple	Type K
Interface	Universal USB 2.0
Power	Rechargeable battery
Software	ERES — thermal efficiency, convection, chain-speed & CPK analysis; Win 7/8/10/11; CN / EN / 繁

Specifications per ESAMBER datasheet V3.5. Subject to change without notice.

Evaluate new oven equipment, allocate the right machine per product, optimize the process, and analyze equipment aging and energy use. Through ERES software it quantifies thermal-efficiency uniformity / balance / shock, hot-air convection, chain-speed fluctuation and CPK capability — surfacing the reflow-oven capability gaps that cause defects.

Application areas

• New reflow oven acceptance
• Machine-per-product allocation
• Process optimization
• Equipment aging analysis
• Energy-saving evaluation
• Defect root-cause (oven capability)

Datasheets