Solder Oven Conveyor/Rail Performance Evaluation System / 焊炉轨道性能评测系统

CBP2000De Conveyor / Rail Performance Evaluation System

Measures rail width, parallelism, deformation, level, incline, climb angle and XYZ vibration in full production — no line stoppage — to prevent board jams, drops and burns.

Pricing: Request a Quote

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Key capabilities

• Measures rail width, parallelism, deformation, level, incline & climb
• XYZ vibration sensing down to ±1 mg resolution
• Tests in live production — no line stoppage required
• Survives 8 min at 300 ℃ inside the oven
• Catches parallelism drift after changeovers before boards jam or drop

Deformation range	0 ~ 15 mm; resolution 0.1 mm; accuracy ±0.2 mm
Angle range	0 ~ 20°; resolution 0.1°; accuracy ±0.2°
Vibration range	±2 g; resolution ±1 mg; sensor accuracy ±2 mg
Temperature range	-50 ~ 800 ℃; accuracy ±0.5 ℃; resolution 0.1 ℃
Sampling rate	0.05 ~ 20 s, adjustable
Heat tolerance	8 min @ 300 ℃ oven
Interface	USB Type-C 5V/1A
Software	CN (Simplified / Traditional), EN, Vietnamese

Specifications per ESAMBER datasheet V3.5. Subject to change without notice.

In live production, without stopping the line, it tests rail width / parallelism, deformation, level, incline, climb gradient and XYZ vibration. Suited to both reflow and wave-solder equipment — especially for verifying parallelism after a product changeover or rail adjustment — preventing the jams, dropped boards and scorched boards that cause loss.

Application areas

• Reflow oven rail diagnostics
• Wave-solder conveyor checks
• Post-changeover parallelism verification
• Rail-adjustment validation
• Jam / drop / scorch prevention

Datasheets